STARTEAM GLOBAL is excited to share progress on the expansion of our Jiangyou STARTEAM (JST) facility in Sichuan, China — on track for completion in Q4 2026.
Recently, members of our leadership team — including Daniel Jacob (CEO), Jacky Yau (COO), HB Yang (Chief Manufacturing Officer), and Victor Huang (JST General Manager) — visited the site to review construction progress. The project remains on track for completion in Q4 2026, marking an important milestone in the development of our manufacturing operations.
Strengthening PCB Manufacturing Capacity
JST is an important part of our history as our first PCB manufacturing site in China. The current expansion includes a new adjacent building designed to integrate with the existing facility.
Upon completion, the expanded site will provide:
- 70,000 m² total production area
- 170,000 m² monthly PCB manufacturing capacity
- This increase enables us to support growing demand for high layer PCB manufacturing and more complex production requirements across a range of industries.
Advancing HDI Capabilities
Our existing capabilities form the foundation for our next major step: expanding our HDI portfolio next year to support server, automotive, high-layer, and advanced technology applications — including any-layer designs. As part of this roadmap, we are preparing to introduce 3+N+3 HDI with staggered vias, supporting up to 26+ layers configurations.
These developments will enable us to address increasing technical requirements such as higher circuit density and more complex designs.
Manufacturing & Process Enhancement
The expanded JST facility will incorporate automation, advanced manufacturing technologies, and end-to-end traceability. These developments support consistent process control and product quality across our operations.
Supporting Future Requirements
With this expansion, we continue to develop our capabilities in PCB manufacturing in China, supporting both increased volume and more advanced technical requirements.
For enquiries related to HDI PCB projects, high-layer designs, or future requirements, please contact:
